Electrical properties of a multilayer thin film substrate for multichip packages

Osamu Shimada, Kenji Ito, Takeshi Miyagi, Susumu Kimijima, Toshio Sudo

研究成果: Paper

9 引用 (Scopus)

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The authors report the electrical properties of multilayer thin-film interconnects examined under circumstances in which the signal lines were sandwiched between mesh-pattern metal layers (called meshed striplines). Multilayer thin-film substrates with various transmission line structures were manufactured with several mesh patterns (power/ground planes) and signal lines, and the characteristic impedance and crosstalk for these lines were measured. The relations between the electrical properties and the meshed-stripline structures were obtained from the measurements for use in designing multilayer thin-film interconnects. It is shown that, in meshed-stripline structures, the characteristic impedance can be controlled by changing the aperture ratio or the mesh pitch. The fluctuation in the characteristic impedance along the signal-propagation direction was insignificant. It was also found that the crosstalk noise in meshed-stripline structures can be made as low as those in ordinary stripline structures.

元の言語English
ページ121-127
ページ数7
出版物ステータスPublished - 1989
イベントSixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Nara, Japan
継続期間: 1989 4 261989 4 28

Other

OtherSixth IEEE/CHMT International Electronic Manufacturing Technology Symposium
Nara, Japan
期間89/4/2689/4/28

ASJC Scopus subject areas

  • Engineering(all)

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  • これを引用

    Shimada, O., Ito, K., Miyagi, T., Kimijima, S., & Sudo, T. (1989). Electrical properties of a multilayer thin film substrate for multichip packages. 121-127. 論文発表場所 Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium, Nara, Japan, .