Electrical properties of a multilayer thin film substrate for multichip packages

Osamu Shimada, Kenji Ito, Takeshi Miyagi, Susumu Kimijima, Toshio Sudo

研究成果査読

10 被引用数 (Scopus)

抄録

The authors report the electrical properties of multilayer thin-film interconnects examined under circumstances in which the signal lines were sandwiched between mesh-pattern metal layers (called meshed striplines). Multilayer thin-film substrates with various transmission line structures were manufactured with several mesh patterns (power/ground planes) and signal lines, and the characteristic impedance and crosstalk for these lines were measured. The relations between the electrical properties and the meshed-stripline structures were obtained from the measurements for use in designing multilayer thin-film interconnects. It is shown that, in meshed-stripline structures, the characteristic impedance can be controlled by changing the aperture ratio or the mesh pitch. The fluctuation in the characteristic impedance along the signal-propagation direction was insignificant. It was also found that the crosstalk noise in meshed-stripline structures can be made as low as those in ordinary stripline structures.

本文言語English
ページ121-127
ページ数7
出版ステータスPublished - 1989
イベントSixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Nara, Japan
継続期間: 1989 4 261989 4 28

Other

OtherSixth IEEE/CHMT International Electronic Manufacturing Technology Symposium
CityNara, Japan
Period89/4/2689/4/28

ASJC Scopus subject areas

  • 工学(全般)

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