| 元の言語 | English |
|---|---|
| ページ（範囲） | 573-578 |
| ジャーナル | Journal of the Electrochemical Society |
| 巻 | 149 |
| 出版物ステータス | Published - 2002 11 1 |
これを引用
T.Osaka, T. O., N.Takano, N. T., T.Kurokawa, T. K., T.Kaneko, T. K., K.Ueno, K. U., & Ueno, K. (2002). Electroless nickel ternally alloy deposition on SiO2 for application to diffusion barrier layer in copper interconnect technology. Journal of the Electrochemical Society, 149, 573-578.
Electroless nickel ternally alloy deposition on SiO2 for application to diffusion barrier layer in copper interconnect technology. / T.Osaka, T.Osaka; N.Takano, N.Takano; T.Kurokawa, T.Kurokawa; T.Kaneko, T.Kaneko; K.Ueno, K.Ueno; Ueno, Kazuyoshi.
：: Journal of the Electrochemical Society, 巻 149, 01.11.2002, p. 573-578.研究成果: Article
T.Osaka, TO, N.Takano, NT, T.Kurokawa, TK, T.Kaneko, TK, K.Ueno, KU & Ueno, K 2002, 'Electroless nickel ternally alloy deposition on SiO2 for application to diffusion barrier layer in copper interconnect technology', Journal of the Electrochemical Society, 巻. 149, pp. 573-578.
T.Osaka TO, N.Takano NT, T.Kurokawa TK, T.Kaneko TK, K.Ueno KU, Ueno K. Electroless nickel ternally alloy deposition on SiO2 for application to diffusion barrier layer in copper interconnect technology. Journal of the Electrochemical Society. 2002 11 1;149:573-578.
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title = "Electroless nickel ternally alloy deposition on SiO2 for application to diffusion barrier layer in copper interconnect technology",
author = "T.Osaka T.Osaka and N.Takano N.Takano and T.Kurokawa T.Kurokawa and T.Kaneko T.Kaneko and K.Ueno K.Ueno and Kazuyoshi Ueno",
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T1 - Electroless nickel ternally alloy deposition on SiO2 for application to diffusion barrier layer in copper interconnect technology
AU - T.Osaka, T.Osaka
AU - N.Takano, N.Takano
AU - T.Kurokawa, T.Kurokawa
AU - T.Kaneko, T.Kaneko
AU - K.Ueno, K.Ueno
AU - Ueno, Kazuyoshi
PY - 2002/11/1
Y1 - 2002/11/1
M3 - Article
VL - 149
SP - 573
EP - 578
JO - Journal of the Electrochemical Society
JF - Journal of the Electrochemical Society
SN - 0013-4651
ER -