Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging

Toshio Sudo, Yakushi Ko, Shingo Sakaguchi, Takeji Tokumaru

研究成果査読

8 被引用数 (Scopus)

抄録

The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.

本文言語English
ページ(範囲)781-785
ページ数5
ジャーナルProceedings - Electronic Components and Technology Conference
出版ステータスPublished - 2000 12 1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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