The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.
|ジャーナル||Proceedings - Electronic Components and Technology Conference|
|出版ステータス||Published - 2000 12 1|
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering