抄録
The effects of the separation of power/ground lines for the core circuits from that for the I/O circuits and increased on-chip capacitance in a micro-controller chip were examined by using transverse electromagnetic (TEM) cell and a near-field probe system. Further, the combination of power/ground island in PCB for the core circuits was examined and analyzed by a simplified SPICE model.
本文言語 | English |
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ページ(範囲) | 781-785 |
ページ数 | 5 |
ジャーナル | Proceedings - Electronic Components and Technology Conference |
出版ステータス | Published - 2000 12月 1 |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 電子工学および電気工学