Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

Y. Shimada; S. Yomogida; S. Akahori; T. Yamamoto; T. Yamaguchi; Y. Aoki; A. Matsuyama; T. Yata; H. Hashimoto; K. Ueno

Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

Y. Shimada, S. Yomogida, S. Akahori, T. Yamamoto, T. Yamaguchi, Y. Aoki, A. Matsuyama, T. Yata, H. Hashimoto, K. Ueno

機能制御システム専攻

研究成果: Article › 査読

本文言語	English
ジャーナル	Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009
出版ステータス	Published - 2009 10月 20

引用スタイル

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title = "Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2",

author = "Y. Shimada and S. Yomogida and S. Akahori and T. Yamamoto and T. Yamaguchi and Y. Aoki and A. Matsuyama and T. Yata and H. Hashimoto and K. Ueno",

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T1 - Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

AU - Shimada, Y.

AU - Yomogida, S.

AU - Akahori, S.

AU - Yamamoto, T.

AU - Yamaguchi, T.

AU - Aoki, Y.

AU - Matsuyama, A.

AU - Yata, T.

AU - Hashimoto, H.

AU - Ueno, K.

PY - 2009/10/20

Y1 - 2009/10/20

M3 - Article

JO - Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009

JF - Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009

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