Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

Y. Shimada, S. Yomogida, S. Akahori, T. Yamamoto, T. Yamaguchi, Y. Aoki, A. Matsuyama, T. Yata, H. Hashimoto, K. Ueno

研究成果: Article

元の言語English
ジャーナルExtended Abstracts of Advanced Metallization Conference (ADMETA) 2009
出版物ステータスPublished - 2009 10 20

これを引用

Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2. / Shimada, Y.; Yomogida, S.; Akahori, S.; Yamamoto, T.; Yamaguchi, T.; Aoki, Y.; Matsuyama, A.; Yata, T.; Hashimoto, H.; Ueno, K.

：: Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009, 20.10.2009.

研究成果: Article

Shimada, Y, Yomogida, S, Akahori, S, Yamamoto, T, Yamaguchi, T, Aoki, Y, Matsuyama, A, Yata, T, Hashimoto, H & Ueno, K 2009, 'Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2', Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009.
Shimada Y, Yomogida S, Akahori S, Yamamoto T, Yamaguchi T, Aoki Y その他. Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2. Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009. 2009 10 20.
Shimada, Y. ; Yomogida, S. ; Akahori, S. ; Yamamoto, T. ; Yamaguchi, T. ; Aoki, Y. ; Matsuyama, A. ; Yata, T. ; Hashimoto, H. ; Ueno, K. / Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2. ：: Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009. 2009.
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AU - Shimada, Y.

AU - Yomogida, S.

AU - Akahori, S.

AU - Yamamoto, T.

AU - Yamaguchi, T.

AU - Aoki, Y.

AU - Matsuyama, A.

AU - Yata, T.

AU - Hashimoto, H.

AU - Ueno, K.

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