Etching method for fabricating ultracompact three-dimensional monolithic microwave integrated circuits

Suehiro Sugitani, Kiyomitsu Onodera, Shinji Aoyama, Makoto Hirano, Masami Tokumitsu

    研究成果: Conference article

    2 引用 (Scopus)

    抜粋

    The fabrication of ultracompact three dimensional monolithic microwave circuits (MMIC) having a sophisticated three-dimensional (3D) interconnection structure was discussed. The circuits were manufactured using the inductively coupled plasma etching with a double-layer mask, consisting of WSi covered with photoresists containing silicon. The developed method enabled the formation of holes to any levels of interconnections simultaneously. It resulted in smaller chip area, higher performance and greater design flexibility in MMICs.

    元の言語English
    ページ(範囲)1019-1025
    ページ数7
    ジャーナルJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
    20
    発行部数3
    DOI
    出版物ステータスPublished - 2002 5 1
    イベント20th North American Conference on Molecular Beam Epitaxy - Providence, RI, United States
    継続期間: 2001 10 12001 10 3

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Electrical and Electronic Engineering

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