TY - JOUR
T1 - Etching method for fabricating ultracompact three-dimensional monolithic microwave integrated circuits
AU - Sugitani, Suehiro
AU - Onodera, Kiyomitsu
AU - Aoyama, Shinji
AU - Hirano, Makoto
AU - Tokumitsu, Masami
PY - 2002/5/1
Y1 - 2002/5/1
N2 - The fabrication of ultracompact three dimensional monolithic microwave circuits (MMIC) having a sophisticated three-dimensional (3D) interconnection structure was discussed. The circuits were manufactured using the inductively coupled plasma etching with a double-layer mask, consisting of WSi covered with photoresists containing silicon. The developed method enabled the formation of holes to any levels of interconnections simultaneously. It resulted in smaller chip area, higher performance and greater design flexibility in MMICs.
AB - The fabrication of ultracompact three dimensional monolithic microwave circuits (MMIC) having a sophisticated three-dimensional (3D) interconnection structure was discussed. The circuits were manufactured using the inductively coupled plasma etching with a double-layer mask, consisting of WSi covered with photoresists containing silicon. The developed method enabled the formation of holes to any levels of interconnections simultaneously. It resulted in smaller chip area, higher performance and greater design flexibility in MMICs.
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U2 - 10.1116/1.1479362
DO - 10.1116/1.1479362
M3 - Conference article
AN - SCOPUS:0035998529
VL - 20
SP - 1019
EP - 1025
JO - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
SN - 1071-1023
IS - 3
T2 - 20th North American Conference on Molecular Beam Epitaxy
Y2 - 1 October 2001 through 3 October 2001
ER -