Experiment on evaporation heat transfer performance of porous surface

Shigeki Hirasawa, Takuya Nakajima, Tetsuya Urimoto, Yuya Tsujimoto, Yusuke Takeuchi, Tsuyoshi Kawanami, Katsuaki Shirai

研究成果: Conference contribution

抄録

Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m2K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m2K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m2K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.

本文言語English
ホスト出版物のタイトルProceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1-5
ページ数5
ISBN(電子版)9781467381215
DOI
出版ステータスPublished - 2016 7 20
外部発表はい
イベント15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 - Las Vegas, United States
継続期間: 2016 5 312016 6 3

出版物シリーズ

名前Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016

Other

Other15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
国/地域United States
CityLas Vegas
Period16/5/3116/6/3

ASJC Scopus subject areas

  • 流体および伝熱
  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料
  • ハードウェアとアーキテクチャ
  • 材料力学

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