Experimental characterization of relationship between S parameters and radiated emission for solid and EBG types of power bus structures

Toshio Sudo, Toshimi Kato, Seiju Ichijo

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

The relationship between S21 properties and far-field radiated emission has been experimentally characterized for various types of power bus structures. As design parameters of power bus structures in printed circuit boards, the effects of VDD plane configuration, insulator thickness between VDD plane and ground plane, on-board capacitors, and signal routing were investigated. First, S21 properties of solid and electromagnetic band-gap (EBG)-type VDD planes were measured for both with and without on-board capacitors. Then, far-field radiated emission was measured for the combination of these design parameters. On-board capacitors induced stop-band in the low frequency range. It has been found that high level of far-field radiated emission was excited at the almost same frequencies of S21 peaks.

元の言語English
ホスト出版物のタイトル2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
出版者Institute of Electrical and Electronics Engineers Inc.
ページ692-695
ページ数4
ISBN(印刷物)142440293X, 9781424402939
DOI
出版物ステータスPublished - 2006
イベント2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 - Portland, OR, United States
継続期間: 2006 8 142006 8 18

出版物シリーズ

名前IEEE International Symposium on Electromagnetic Compatibility
3
ISSN(印刷物)1077-4076

Conference

Conference2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006
United States
Portland, OR
期間06/8/1406/8/18

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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  • これを引用

    Sudo, T., Kato, T., & Ichijo, S. (2006). Experimental characterization of relationship between S parameters and radiated emission for solid and EBG types of power bus structures. : 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006 (pp. 692-695). [1706398] (IEEE International Symposium on Electromagnetic Compatibility; 巻数 3). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/isemc.2006.1706398