CMOS-based multichip modules have been actively developed for achieving high performance and high speed systems. Simultaneous switching noise (SSN) induced by CMOS output buffers is a serious issue in multichip modules as well as single-chip packages to ensure stable operation and to derive inherent speed performance. Multichip modules are expected to have smaller switching noise level than the case of single-chip packages by removing a first-level package and its parasitics. This paper reports the measurement results of switching noises for different types of MCMs using a switching noise generating chip. Two types of test vehicles were fabricated and measurement results were compared. Noise distribution on a ground plane was also measured.
|出版ステータス||Published - 1995 1月 1|
|イベント||Proceedings of the 1995 IEEE Multi-Chip Module Conference - Santa Cruz, CA, USA|
継続期間: 1995 1月 31 → 1995 2月 2
|Other||Proceedings of the 1995 IEEE Multi-Chip Module Conference|
|City||Santa Cruz, CA, USA|
|Period||95/1/31 → 95/2/2|
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