抄録
CMOS-based multichip modules have been actively developed for achieving high performance and high speed systems. Simultaneous switching noise (SSN) induced by CMOS output buffers is a serious issue in multichip modules as well as single-chip packages to ensure stable operation and to derive inherent speed performance. Multichip modules are expected to have smaller switching noise level than the case of single-chip packages by removing a first-level package and its parasitics. This paper reports the measurement results of switching noises for different types of MCMs using a switching noise generating chip. Two types of test vehicles were fabricated and measurement results were compared. Noise distribution on a ground plane was also measured.
本文言語 | English |
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ページ | 217-220 |
ページ数 | 4 |
出版ステータス | Published - 1995 1月 1 |
イベント | Proceedings of the 1995 IEEE Multi-Chip Module Conference - Santa Cruz, CA, USA 継続期間: 1995 1月 31 → 1995 2月 2 |
Other
Other | Proceedings of the 1995 IEEE Multi-Chip Module Conference |
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City | Santa Cruz, CA, USA |
Period | 95/1/31 → 95/2/2 |
ASJC Scopus subject areas
- 電子工学および電気工学