Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition

Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka, Tadatomo Suga

研究成果: Paper

4 引用 (Scopus)

抜粋

The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

元の言語English
ページ103-108
ページ数6
出版物ステータスPublished - 2004 9 20
外部発表Yes
イベントITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, United States
継続期間: 2004 6 12004 6 4

Conference

ConferenceITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
United States
Las Vegas, NV
期間04/6/104/6/4

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

フィンガープリント Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Kariya, Y., Hosoi, T., Kimura, T., Terashima, S., Tanaka, M., & Suga, T. (2004). Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition. 103-108. 論文発表場所 ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, United States.