抄録
The mechanical shear fatigue test has been performed to investigate the fatigue properties of Sn-1.2mass%Ag-0.5mass%Cu-0.05mass%Ni for flip chip interconnections. The low cycle fatigue endurance of the alloy is almost equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-lmass%Ag-0.5mass%Cu alloy was poorer than that of the 3mass%Ag alloy. Adding Ni to low silver content Sn-Ag-Cu alloy leaded to fine microstructure, and the microstructure had a network structure of Ag3Sn intermetallic compound together with fine Cu-Sn intermetallic compound. The microstructure resulted in high strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.
| 本文言語 | English |
|---|---|
| ページ | 103-108 |
| ページ数 | 6 |
| 出版ステータス | Published - 2004 9月 20 |
| 外部発表 | はい |
| イベント | ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, United States 継続期間: 2004 6月 1 → 2004 6月 4 |
Conference
| Conference | ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
|---|---|
| 国/地域 | United States |
| City | Las Vegas, NV |
| Period | 04/6/1 → 04/6/4 |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 凝縮系物理学
- 電子工学および電気工学
- 材料化学