Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Kouichi Moroka, Yoshiharu Kariya

研究成果: Conference contribution

抄録

The fatigue life of a joint in the semiconductor packagedecreases with an increase in creep deformation associated with microstructural changes occurred while in use. Particularly, the life difference in the field is remarkable. In life prediction, considering microstructural changes is absolutely necessary.

元の言語English
ホスト出版物のタイトルProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
出版者Institute of Electrical and Electronics Engineers Inc.
ページ数1
ISBN(電子版)9784904743072
DOI
出版物ステータスPublished - 2019 5 1
イベント6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
継続期間: 2019 5 212019 5 25

出版物シリーズ

名前Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Japan
Kanazawa, Ishikawa
期間19/5/2119/5/25

Fingerprint

Coarsening
Soldering alloys
Creep
Fatigue of materials
Semiconductor materials

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

これを引用

Moroka, K., & Kariya, Y. (2019). Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 [8735151] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735151

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening. / Moroka, Kouichi; Kariya, Yoshiharu.

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8735151 (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Moroka, K & Kariya, Y 2019, Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019., 8735151, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Institute of Electrical and Electronics Engineers Inc., 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Kanazawa, Ishikawa, Japan, 19/5/21. https://doi.org/10.23919/LTB-3D.2019.8735151
Moroka K, Kariya Y. Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). https://doi.org/10.23919/LTB-3D.2019.8735151
Moroka, Kouichi ; Kariya, Yoshiharu. / Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening. Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).
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