Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,

N.Hirano N.Hirano; K.Doi K.Doi; E.Hosomi E.Hosomi; H.Tazawa H.Tazawa; K.Shibazaki K.Shibazaki; C.Takubo C.Takubo; T.Okada T.Okada; Y.Hiruta Y.Hiruta; T.Sudo T.Sudo; Toshio Sudo

Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,

N.Hirano N.Hirano, K.Doi K.Doi, E.Hosomi E.Hosomi, H.Tazawa H.Tazawa, K.Shibazaki K.Shibazaki, C.Takubo C.Takubo, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

機能制御システム専攻

研究成果: Article › 査読

本文言語	English
ページ（範囲）	15-17
ジャーナル	VLSI and Microsystem Packaging Workshop, Baveno Italy,
出版ステータス	Published - 1996 10 15

引用スタイル

Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps, / N.Hirano, N.Hirano; K.Doi, K.Doi; E.Hosomi, E.Hosomi; H.Tazawa, H.Tazawa; K.Shibazaki, K.Shibazaki; C.Takubo, C.Takubo; T.Okada, T.Okada; Y.Hiruta, Y.Hiruta; T.Sudo, T.Sudo; Sudo, Toshio.

In: VLSI and Microsystem Packaging Workshop, Baveno Italy, 15.10.1996, p. 15-17.

研究成果: Article › 査読

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