A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.
|ジャーナル||IEEE MTT-S International Microwave Symposium Digest|
|出版ステータス||Published - 1996 1月 1|
|イベント||Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA|
継続期間: 1996 6月 17 → 1996 6月 21
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