Folded U-shaped microwire technology for ultra-compact 3D MMICs

Kiyomitsu Onodera, Makoto Hirano, Ichihiko Toyoda, Masami Tokumitsu, Tsuneo Tokumitsu

    研究成果: Conference article

    4 引用 (Scopus)

    抜粋

    A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.

    元の言語English
    ページ(範囲)1153-1156
    ページ数4
    ジャーナルIEEE MTT-S International Microwave Symposium Digest
    2
    出版物ステータスPublished - 1996 1 1
    イベントProceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA
    継続期間: 1996 6 171996 6 21

    ASJC Scopus subject areas

    • Radiation
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

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  • これを引用

    Onodera, K., Hirano, M., Toyoda, I., Tokumitsu, M., & Tokumitsu, T. (1996). Folded U-shaped microwire technology for ultra-compact 3D MMICs. IEEE MTT-S International Microwave Symposium Digest, 2, 1153-1156.