Forming of aluminum foam using steel mesh as die during foaming of precursor by optical heating

Yoshihiko Hangai, Kenji Amagai, Kazuki Omachi, Nozomi Tsurumi, Takao Utsunomiya, Nobuhiro Yoshikawa

研究成果: Article

10 引用 (Scopus)


Ultralightweight aluminum foam (Al foam) is expected to be used for the components of vehicles and construction materials. To apply Al foam in these industrial fields, the fabrication of Al foam with complex shapes is an important requirement. In this study, a steel mesh was used as a die for fabricating Al foam with a complex shape during the foaming of a precursor by employing optical heating. From the free foaming of the ADC12 precursor, it was shown that the precursor can be foamed by passing light through the steel mesh similarly to the foaming without the steel mesh. In addition, it was shown that ADC12 foams with similar porosity and pore structures were obtained both with and without the steel mesh. From the foaming of the ADC12 precursor while restricting its upward expansion by the steel mesh, it was shown that ADC12 foam with plane surface can be obtained. No protrusion of ADC12 foam through the mesh openings was observed. The steel mesh was easily peeled off from the ADC12 foam after the foam had solidified. Similar pore structures to those in the case of free foaming were obtained and no collapse of the pores at the surface in contact with the steel mesh was observed. From the foaming of the ADC12 precursor in steel mesh dies with triangular and square cross sections, it was shown that ADC12 foam with similar shapes to the steel mesh die and similar pore structures to those in the case of free foaming can be obtained. Consequently, it was demonstrated that a steel mesh can be used as a die for the forming of ADC12 foam with little effect on the pore structures of the obtained foam.

ジャーナルOptics and Laser Technology
出版物ステータスPublished - 2018 12 1


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering