Fracture Simulation of Redistribution Layer in Fan-Out Wafer-Level Package Based on Fatigue Crack Growth Characteristics of Insulating Polymer

Engineering & Materials Science

• Phenolic resins 100%
• Polyimides 96%
• Fatigue crack propagation 84%
• Fans 76%
• Polymers 60%
• Energy release rate 58%
• Cracks 22%
• Electric wiring 17%
• Finite element method 15%
• Resins 14%
• Crack propagation 14%
• Phenols 10%
• Fracture mechanics 8%
• Thermal stress 8%
• Hot Temperature 7%
• Copper 6%
• Fatigue of materials 5%
• Temperature 3%

Chemical Compounds

• Polyimide Macromolecule 72%
• Simulation 52%
• Crack Propagation 31%
• Energy 21%
• Fracture Mechanics 11%
• Liquid Film 7%
• Phenol 5%
• Ambient Reaction Temperature 4%