Fundamental study on electrically-induced bubble catalytic plating technology

Yudai Fukuyama, Keita Ichikawa, Shingo Maeda, Yoko Yamanishi

研究成果: Conference contribution

抜粋

We have succeeded in metallization by embedding metal on the flexible polymer substrate such as PDMS. Novel points of this technology are shown as follows. 1. It eliminates complicated pretreatment processes on the substrate surface before plating, so it is less expensive than electroless plating. 2. Plating resolution in micro-meter order can be achieved with low cost. 3. It is possible to perform local and precise metallization on a wide range of materials without using specialized techniques such as photolithography.

元の言語English
ホスト出版物のタイトルMHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science
出版者Institute of Electrical and Electronics Engineers Inc.
ページ1-3
ページ数3
2018-January
ISBN(電子版)9781538633144
DOI
出版物ステータスPublished - 2018 2 28
イベント28th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2017 - Nagoya, Japan
継続期間: 2017 12 32017 12 6

Other

Other28th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2017
Japan
Nagoya
期間17/12/317/12/6

    フィンガープリント

ASJC Scopus subject areas

  • Biotechnology
  • Biomedical Engineering
  • Electrical and Electronic Engineering
  • Mechanical Engineering

これを引用

Fukuyama, Y., Ichikawa, K., Maeda, S., & Yamanishi, Y. (2018). Fundamental study on electrically-induced bubble catalytic plating technology. : MHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science (巻 2018-January, pp. 1-3). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MHS.2017.8305166