Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections

研究成果: Article › 査読

本文言語	English
ページ（範囲）	357-366
ジャーナル	International Conference on Electronic Materials, Proceedings Volume
出版ステータス	Published - 1995 1月 1

引用スタイル

@article{7bdb00a71967442a9ad80d4c3df7c236,

title = "Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections",

author = "T. Homma",

year = "1995",

month = jan,

day = "1",

language = "English",

pages = "357--366",

journal = "International Conference on Electronic Materials, Proceedings Volume",

}