Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections

研究成果: Article

5 引用 (Scopus)
元の言語English
ページ(範囲)357-366
ジャーナルInternational Conference on Electronic Materials, Proceedings Volume
出版物ステータスPublished - 1995 1 1

これを引用

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title = "Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections",
author = "T. Homma",
year = "1995",
month = "1",
day = "1",
language = "English",
pages = "357--366",
journal = "International Conference on Electronic Materials, Proceedings Volume",

}

TY - JOUR

T1 - Future Trend for Interlayer Dielectric Films and Their Formation Technomogies in VLSI Multilevel Interconnections

AU - Homma, T.

PY - 1995/1/1

Y1 - 1995/1/1

M3 - Article

SP - 357

EP - 366

JO - International Conference on Electronic Materials, Proceedings Volume

JF - International Conference on Electronic Materials, Proceedings Volume

ER -