Future Trend for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections

研究成果: Article › 査読

本文言語	English
ページ（範囲）	117
ジャーナル	International Conference on Electronic Materials (ICEM) Abstracts（Symposium E2.5）
出版ステータス	Published - 1994 12月 19

引用スタイル

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title = "Future Trend for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections",

author = "T. Homma",

year = "1994",

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JO - International Conference on Electronic Materials (ICEM) Abstracts（Symposium E2.5）

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