Grain growth of electroplated copper film by alternative annealing methods

Kazuyoshi Ueno, Kouichiro Shimotani, Yuji Shimada, Shigeru Yomogida, Takato Takeshita, Akiko Hashimoto, Takashi Yata

研究成果: Conference contribution

2 引用 (Scopus)

抜粋

Alternative annealing methods using current stress or supercritical fluid (SCF) are investigated for electroplated copper (Cu) films. The current stress method promotes grain growth at room temperature, mostly through the Joule heating effect. The grain size resulting from the SCF annealing method was more uniform; therefore, it is a potentially better method for improvement of the microstructure in electroplated Cu films.

元の言語English
ホスト出版物のタイトルAdvanced Metallization Conference 2008, AMC 2008
ページ283-287
ページ数5
出版物ステータスPublished - 2009 10 19
イベントAdvanced Metallization Conference 2008, AMC 2008 - San Diego, CA, United States
継続期間: 2008 9 232008 9 25

出版物シリーズ

名前Advanced Metallization Conference (AMC)
ISSN(印刷物)1540-1766

Conference

ConferenceAdvanced Metallization Conference 2008, AMC 2008
United States
San Diego, CA
期間08/9/2308/9/25

ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

フィンガープリント Grain growth of electroplated copper film by alternative annealing methods' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Ueno, K., Shimotani, K., Shimada, Y., Yomogida, S., Takeshita, T., Hashimoto, A., & Yata, T. (2009). Grain growth of electroplated copper film by alternative annealing methods. : Advanced Metallization Conference 2008, AMC 2008 (pp. 283-287). (Advanced Metallization Conference (AMC)).