Grain growth of electroplated copper film by alternative annealing methods

Kazuyoshi Ueno, Kouichiro Shimotani, Yuji Shimada, Shigeru Yomogida, Takato Takeshita, Akiko Hashimoto, Takashi Yata

研究成果: Conference contribution

2 引用 (Scopus)

抄録

Alternative annealing methods using current stress or supercritical fluid (SCF) are investigated for electroplated copper (Cu) films. The current stress method promotes grain growth at room temperature, mostly through the Joule heating effect. The grain size resulting from the SCF annealing method was more uniform; therefore, it is a potentially better method for improvement of the microstructure in electroplated Cu films.

元の言語English
ホスト出版物のタイトルAdvanced Metallization Conference (AMC)
ページ283-287
ページ数5
出版物ステータスPublished - 2009
イベントAdvanced Metallization Conference 2008, AMC 2008 - San Diego, CA
継続期間: 2008 9 232008 9 25

Other

OtherAdvanced Metallization Conference 2008, AMC 2008
San Diego, CA
期間08/9/2308/9/25

Fingerprint

Supercritical fluids
Grain growth
Copper
Annealing
Joule heating
Microstructure
Temperature

ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

これを引用

Ueno, K., Shimotani, K., Shimada, Y., Yomogida, S., Takeshita, T., Hashimoto, A., & Yata, T. (2009). Grain growth of electroplated copper film by alternative annealing methods. : Advanced Metallization Conference (AMC) (pp. 283-287)

Grain growth of electroplated copper film by alternative annealing methods. / Ueno, Kazuyoshi; Shimotani, Kouichiro; Shimada, Yuji; Yomogida, Shigeru; Takeshita, Takato; Hashimoto, Akiko; Yata, Takashi.

Advanced Metallization Conference (AMC). 2009. p. 283-287.

研究成果: Conference contribution

Ueno, K, Shimotani, K, Shimada, Y, Yomogida, S, Takeshita, T, Hashimoto, A & Yata, T 2009, Grain growth of electroplated copper film by alternative annealing methods. : Advanced Metallization Conference (AMC). pp. 283-287, Advanced Metallization Conference 2008, AMC 2008, San Diego, CA, 08/9/23.
Ueno K, Shimotani K, Shimada Y, Yomogida S, Takeshita T, Hashimoto A その他. Grain growth of electroplated copper film by alternative annealing methods. : Advanced Metallization Conference (AMC). 2009. p. 283-287
Ueno, Kazuyoshi ; Shimotani, Kouichiro ; Shimada, Yuji ; Yomogida, Shigeru ; Takeshita, Takato ; Hashimoto, Akiko ; Yata, Takashi. / Grain growth of electroplated copper film by alternative annealing methods. Advanced Metallization Conference (AMC). 2009. pp. 283-287
@inproceedings{29fb937bd3654c609b51d0f3b5633881,
title = "Grain growth of electroplated copper film by alternative annealing methods",
abstract = "Alternative annealing methods using current stress or supercritical fluid (SCF) are investigated for electroplated copper (Cu) films. The current stress method promotes grain growth at room temperature, mostly through the Joule heating effect. The grain size resulting from the SCF annealing method was more uniform; therefore, it is a potentially better method for improvement of the microstructure in electroplated Cu films.",
author = "Kazuyoshi Ueno and Kouichiro Shimotani and Yuji Shimada and Shigeru Yomogida and Takato Takeshita and Akiko Hashimoto and Takashi Yata",
year = "2009",
language = "English",
isbn = "9781605111254",
pages = "283--287",
booktitle = "Advanced Metallization Conference (AMC)",

}

TY - GEN

T1 - Grain growth of electroplated copper film by alternative annealing methods

AU - Ueno, Kazuyoshi

AU - Shimotani, Kouichiro

AU - Shimada, Yuji

AU - Yomogida, Shigeru

AU - Takeshita, Takato

AU - Hashimoto, Akiko

AU - Yata, Takashi

PY - 2009

Y1 - 2009

N2 - Alternative annealing methods using current stress or supercritical fluid (SCF) are investigated for electroplated copper (Cu) films. The current stress method promotes grain growth at room temperature, mostly through the Joule heating effect. The grain size resulting from the SCF annealing method was more uniform; therefore, it is a potentially better method for improvement of the microstructure in electroplated Cu films.

AB - Alternative annealing methods using current stress or supercritical fluid (SCF) are investigated for electroplated copper (Cu) films. The current stress method promotes grain growth at room temperature, mostly through the Joule heating effect. The grain size resulting from the SCF annealing method was more uniform; therefore, it is a potentially better method for improvement of the microstructure in electroplated Cu films.

UR - http://www.scopus.com/inward/record.url?scp=70349969400&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=70349969400&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:70349969400

SN - 9781605111254

SP - 283

EP - 287

BT - Advanced Metallization Conference (AMC)

ER -