Handwritten Cube Recognition and Evaluation Based on Perspectives for Sketch Training System

Yuki Kuribayashi, Eito Yamaga, Takeshi Sasaki

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

A sketch is useful as a communication tool. By expressing ideas using sketches, we can explain the information we want to convey to others in an easy-to-understand way. In general, learning sketches is done by experienced teacher feedback. If we can do this approach with technology, we can expect to provide sketch education opportunities to many people. In our system, utilizing the fact that cube sketch can be evaluated by perspective, we recognize and evaluate the sketch of the learner's cube and educate sketch acquisition by feeding back the mistake. The developed system is evaluated by testing whether the handwritten cube can be recognized and whether we can point out the mistakes of the learner's cube correctly.

元の言語English
ホスト出版物のタイトルProceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019
出版者Institute of Electrical and Electronics Engineers Inc.
ページ34-39
ページ数6
ISBN(電子版)9781538636152
DOI
出版物ステータスPublished - 2019 4 25
イベント2019 IEEE/SICE International Symposium on System Integration, SII 2019 - Paris, France
継続期間: 2019 1 142019 1 16

出版物シリーズ

名前Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019

Conference

Conference2019 IEEE/SICE International Symposium on System Integration, SII 2019
France
Paris
期間19/1/1419/1/16

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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  • これを引用

    Kuribayashi, Y., Yamaga, E., & Sasaki, T. (2019). Handwritten Cube Recognition and Evaluation Based on Perspectives for Sketch Training System. : Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019 (pp. 34-39). [8700369] (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SII.2019.8700369