High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Koji Osaki, Yoshiharu Kariya, Noritsuka Mizumura, Koji Sasaki

研究成果: Conference contribution

抄録

The exponent of the fatigue crack propagation law of the sintered Ag was decreased with an increase in temperature. The decreasing the exponent was related to the viscous behavior of the grain boundaries. However, the exponent increased again at 473K that was associated by a decrease in CTOD due to progression of sintering.

元の言語English
ホスト出版物のタイトルProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
出版者Institute of Electrical and Electronics Engineers Inc.
ページ数1
ISBN(電子版)9784904743072
DOI
出版物ステータスPublished - 2019 5 1
イベント6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
継続期間: 2019 5 212019 5 25

出版物シリーズ

名前Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Japan
Kanazawa, Ishikawa
期間19/5/2119/5/25

Fingerprint

Fatigue crack propagation
Silver
Grain boundaries
Sintering
Nanoparticles
Temperature

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

これを引用

Osaki, K., Kariya, Y., Mizumura, N., & Sasaki, K. (2019). High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 [8735315] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735315

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles. / Osaki, Koji; Kariya, Yoshiharu; Mizumura, Noritsuka; Sasaki, Koji.

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8735315 (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Osaki, K, Kariya, Y, Mizumura, N & Sasaki, K 2019, High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019., 8735315, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Institute of Electrical and Electronics Engineers Inc., 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Kanazawa, Ishikawa, Japan, 19/5/21. https://doi.org/10.23919/LTB-3D.2019.8735315
Osaki K, Kariya Y, Mizumura N, Sasaki K. High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). https://doi.org/10.23919/LTB-3D.2019.8735315
Osaki, Koji ; Kariya, Yoshiharu ; Mizumura, Noritsuka ; Sasaki, Koji. / High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles. Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).
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