High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Koji Osaki, Yoshiharu Kariya, Noritsuka Mizumura, Koji Sasaki

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

The exponent of the fatigue crack propagation law of the sintered Ag was decreased with an increase in temperature. The decreasing the exponent was related to the viscous behavior of the grain boundaries. However, the exponent increased again at 473K that was associated by a decrease in CTOD due to progression of sintering.

本文言語English
ホスト出版物のタイトルProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
出版社Institute of Electrical and Electronics Engineers Inc.
ページ数1
ISBN(電子版)9784904743072
DOI
出版ステータスPublished - 2019 5
イベント6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
継続期間: 2019 5 212019 5 25

出版物シリーズ

名前Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
国/地域Japan
CityKanazawa, Ishikawa
Period19/5/2119/5/25

ASJC Scopus subject areas

  • プロセス化学およびプロセス工学
  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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