抄録
Epitaxial layers of AlGaN/GaN were grown on semi-insulating (SI) silicon carbide (SiC) by metalorganic chemical vapor deposition (MOCVD) with a very high electron sheet carrier density ns = 1.2 × 1013 cm-2 and a Hall carrier mobility as high as μH = 1281 cm2/Vs at room temperature. High-electron-mobility transistors (HEMTs) have been demonstrated using an AlGaN/GaN heterostructure on a SI-SiC substrate. The fabricated 2.2-μm-gate-length Al0.26Ga0.74N/GaN HEMTs exhibited extrinsic transconductance as high as 287 mS/mm with drain-source current density as high as 857 mA/mm. This is the first report of such high transconductance achieved so far for 2.2-μm-gate-length Al0.26Ga0.74N/GaN HEMTs on SI-SiC substrates. A very small percentage (3%) of drain-source current density reduction at the gate voltage of +1.5 V has been observed for HEMTs on SI-SiC substrates. The observation of high extrinsic transconductance can be explained with the help of intrinsic transconductance values.
本文言語 | English |
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ページ(範囲) | L1081-L1083 |
ジャーナル | Japanese Journal of Applied Physics, Part 2: Letters |
巻 | 40 |
号 | 10 B |
DOI | |
出版ステータス | Published - 2001 10月 15 |
外部発表 | はい |
ASJC Scopus subject areas
- 工学(全般)
- 物理学および天文学(全般)