Highly-integrated three-dimensional MMIC 20-GHz single chip receiver

Kenjiro Nishikawa, Kenji Kamogawa, Tsuneo Tokumitsu, Masayoshi Aikawa, Makoto Hirano, Suehiro Sugitani

    研究成果: Paper査読

    8 被引用数 (Scopus)

    抄録

    A highly-integrated, three-dimensional 20-GHz band single chip receiver employing four thin polyimide films on a GaAs wafer is presented. The fabricated receiver implements three RF variable-gain amplifiers, an image rejectlon mixer, two LO amplifiers, and a voltage controlled oscillatorin an areaof only 1.78 mm × 1.78 mm. The performances of the demonstrated receiver are a 17dB gain and an integration level about three times as high as those of conventional receiver MMICs. The design methodologies used to achieve compact RF circuits on a single chip are also described.

    本文言語English
    ページ199-203
    ページ数5
    DOI
    出版ステータスPublished - 1996 1 1
    イベント1996 26th European Microwave Conference, EuMC 1996 - Prague, Czech Republic
    継続期間: 1996 9 61996 9 13

    Conference

    Conference1996 26th European Microwave Conference, EuMC 1996
    国/地域Czech Republic
    CityPrague
    Period96/9/696/9/13

    ASJC Scopus subject areas

    • コンピュータ ネットワークおよび通信
    • ハードウェアとアーキテクチャ
    • 電子工学および電気工学

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