Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's

Tsuneo Tokumitsu, Makoto Hirano, Kimiyoshi Yamasaki, Chikara Yamaguchi, Kenjiro Nishikawa, Masayoshi Aikawa

    研究成果: Article

    元の言語English
    ジャーナルIEEE Journal of Solid-State Circuits
    32
    出版物ステータスPublished - 1997 4 1

    これを引用

    Tokumitsu, T., Hirano, M., Yamasaki, K., Yamaguchi, C., Nishikawa, K., & Aikawa, M. (1997). Highly- Intergrated 3-D MMIC Technology Being Applied to Novel Masterslice GaAs-and Si-MMIC's. IEEE Journal of Solid-State Circuits, 32.