Hole drilling in stainless steel and silicon by femtosecond pulses at low pressure

S. Juodkazis, H. Okuno, N. Kujime, S. Matsuo, H. Misawa

研究成果: Article

31 引用 (Scopus)

抜粋

We report on the ablation and hole drilling in stainless steel SUS304 and Si by femtosecond pulses (wavelength 800 nm; pulse duration > 80 fs) at the room and low (5 Torr) air pressure ambient. It was found that the quality of surface processing is improved at low pressure avoiding debris formation. The improvement is due to suppression of the conical emission, resulting from the air optical breakdown at a pre-surface area of sample. Debris-free processing of the movable Si-MEMS components is demonstrated. Techniques for the precise measurement of focal spot size and pulse duration are discussed.

元の言語English
ページ(範囲)1555-1559
ページ数5
ジャーナルApplied Physics A: Materials Science and Processing
79
発行部数4-6
DOI
出版物ステータスPublished - 2004
外部発表Yes

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)

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