Impact of fault resistance on impedance relay: Adaptive Mho directional type scheme development using LabVIEW

David Majambere, Goro Fujita

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

Normally, fault resistances come out with errors in the fault calculation algorithm on conventional Mho distance protection scheme which might force the relay to under-reach/over-reach based on the network conditions. With a constrained shape, Mho Directional distance elements can provide more resistive coverage while discriminating between forward and reverse faults. In this work, the recurring effect a fault resistance can have on a Mho Distance protection scheme relay is assessed and analyzed for single line-to-ground(SLG) faults for both protective schemes. Finally, an adaptive correction algorithm is applied to compensate errors introduced in the fault calculation unit using local end data. The design and simulation are performed using LabVIEW and MATLAB/SIMULINK. Magnitudes and angles of three voltages and currents are obtained through Discrete Fourier Transform(DFT). Different scenarios are carried out and validate the effectiveness of the scheme. Moreover, an improved Graphical User Interface(GUI) is developed for easy and convenient interaction between users and the relay model.

元の言語English
ホスト出版物のタイトルTENCON 2017 - 2017 IEEE Region 10 Conference
出版者Institute of Electrical and Electronics Engineers Inc.
ページ3006-3011
ページ数6
2017-December
ISBN(電子版)9781509011339
DOI
出版物ステータスPublished - 2017 12 19
イベント2017 IEEE Region 10 Conference, TENCON 2017 - Penang, Malaysia
継続期間: 2017 11 52017 11 8

Other

Other2017 IEEE Region 10 Conference, TENCON 2017
Malaysia
Penang
期間17/11/517/11/8

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

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  • これを引用

    Majambere, D., & Fujita, G. (2017). Impact of fault resistance on impedance relay: Adaptive Mho directional type scheme development using LabVIEW. : TENCON 2017 - 2017 IEEE Region 10 Conference (巻 2017-December, pp. 3006-3011). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.2017.8228377