抜粋
The optical propagation loss of rib waveguides fabricated on magnetic garnet films increased upon annealing in H2 ambient during wafer direct bonding. The heat treatment in wafer direct bonding between InP and Gd3Ga5O12 was investigated with the aim of circumventing the loss increase. The bonding was achieved by heat treatment in H2 ambient at temperatures of ≦ 330°C or in N2 ambient.
| 元の言語 | English |
|---|---|
| ページ（範囲） | 2784-2787 |
| ページ数 | 4 |
| ジャーナル | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers |
| 巻 | 36 |
| 発行部数 | 5 A |
| 出版物ステータス | Published - 1997 5 1 |
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)
フィンガープリント Improved heat treatment for wafer direct bonding between semiconductors and magnetic garnets' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。
これを引用
Yokoi, H., Mizumoto, T., Maru, K., & Naito, Y. (1997). Improved heat treatment for wafer direct bonding between semiconductors and magnetic garnets. Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 36(5 A), 2784-2787.