Influence of temperature and dwelling time on low-cycle fatigue characteristic of isotropic conductive adhesive joint

Yoshiharu Kariya, Yoshihiko Kanda, Keitaro Iguchi, Hiromitsu Furusawa

研究成果: Article査読

12 被引用数 (Scopus)

抄録

The effects of temperature and dwell time on the low-cycle fatigue life of Ag-epoxy based conductive adhesive have been investigated by using a micro-joint specimen. The low cycle fatigue life of the conductive adhesive increases when test temperature is elevated beyond the glass transition point. On the other hand, the dwell time at 398 K reduces the fatigue life, which, however, is increased by the dwell time at 348 K. The cross-sectional image suggests the embrittlement of epoxy resin during the dwell time at 398 K, which reduces the fatigue endurance of the conductive adhesive. In contrast, some kind of recovery effects exists during dwell time near the glass transition temperature, which improves the fatigue life.

本文言語English
ページ(範囲)1779-1784
ページ数6
ジャーナルMaterials Transactions
51
10
DOI
出版ステータスPublished - 2010 10

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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