Integrating laser diode and optical isolator by photosensitive adhesive bonding

H. Yokoi, N. Ichishima, I. Myouenzono

研究成果: Conference contribution

抄録

An integrating technique between a laser diode and an optical isolator is proposed. The optical isolator has a magneto-optic waveguide with a Si guiding layer. The laser diode is integrated with the optical isolator by use of photosensitive adhesive bonding. A coupling efficiency between an active layer of the laser diode and a passive waveguide is discussed. Photosensitive adhesive bonding between a garnet crystal and a SiO2 substrate is demonstrated.

本文言語English
ホスト出版物のタイトルSemiconductor Wafer Bonding 12
ホスト出版物のサブタイトルScience, Technology, and Applications
出版社Electrochemical Society Inc.
ページ393-398
ページ数6
7
ISBN(印刷版)9781607683551
DOI
出版ステータスPublished - 2013
イベント12th International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications - ECS Fall 2012 Meeting - Honolulu, HI, United States
継続期間: 2012 10 72012 10 12

出版物シリーズ

名前ECS Transactions
番号7
50
ISSN(印刷版)1938-5862
ISSN(電子版)1938-6737

Conference

Conference12th International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications - ECS Fall 2012 Meeting
国/地域United States
CityHonolulu, HI
Period12/10/712/10/12

ASJC Scopus subject areas

  • 工学(全般)

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