Integration of terraced laser diode and optical isolator by wafer direct bonding

Hideki Yokoi, Tetsuya Mizumoto

研究成果: Paper査読

抄録

Wafer direct bonding is a technique for integration of dissimilar materials without any adhesives. This technique is applied to the bonding between III-V compound semiconductors and garnet crystals, to integrate a laser diode and an optical isolator. The isolator is contacted with the terraced laser diode by wafer bonding and heat treatment in hydrogen ambience.

本文言語English
ページ数1
出版ステータスPublished - 2000 1 1
外部発表はい
イベント2000 Confernce on Lasers and Electro-Optics Europe (CLEO 2000) - Nice, France
継続期間: 2000 9 102000 9 15

Other

Other2000 Confernce on Lasers and Electro-Optics Europe (CLEO 2000)
CityNice, France
Period00/9/1000/9/15

ASJC Scopus subject areas

  • 制御およびシステム工学
  • 電子工学および電気工学

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