| 本文言語 | English |
|---|---|
| ジャーナル | Default journal |
| 出版ステータス | Published - 2000 3月 1 |
Interfacial Microstructure and Mechanical Reliability of Sn-Ag Solder Joint on Electroless Ni-P Film
Yoshiharu Kariya, Kumiko Nakamura, Yasunori Tanaka, Masahisa Otsuka
研究成果: Article › 査読