Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor

Tatsuru Tamori, Kan Akatsu

研究成果: Conference contribution

抄録

Recently, a miniaturization of the inverter module in the drive system is proceeding. One of the problems of the miniaturization of the inverter module is the heat generation density increase as the inverter module becomes smaller. Since a bonding wire in the inverter module is disconnected due to heat, it is necessary to early detect the disconnection for the protection of the system. In this research, by setting a GMR sensor under the bonding wire in the inverter module, we propose a small inverter module with a built-in GMR sensor. This paper focuses on a method of disconnection detection with the GMR sensor at under the bonding wire and selecting the appropriate GMR sensor position.

元の言語English
ホスト出版物のタイトルICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia
出版者Institute of Electrical and Electronics Engineers Inc.
ページ1990-1995
ページ数6
ISBN(電子版)9788957083130
出版物ステータスPublished - 2019 5 1
イベント10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia - Busan, Korea, Republic of
継続期間: 2019 5 272019 5 30

出版物シリーズ

名前ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia

Conference

Conference10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia
Korea, Republic of
Busan
期間19/5/2719/5/30

Fingerprint

Electric current measurement
Wire
Sensors
Heat generation

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Control and Optimization

これを引用

Tamori, T., & Akatsu, K. (2019). Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. : ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia (pp. 1990-1995). [8796967] (ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia). Institute of Electrical and Electronics Engineers Inc..

Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. / Tamori, Tatsuru; Akatsu, Kan.

ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia. Institute of Electrical and Electronics Engineers Inc., 2019. p. 1990-1995 8796967 (ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia).

研究成果: Conference contribution

Tamori, T & Akatsu, K 2019, Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. : ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia., 8796967, ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia, Institute of Electrical and Electronics Engineers Inc., pp. 1990-1995, 10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia, Busan, Korea, Republic of, 19/5/27.
Tamori T, Akatsu K. Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. : ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia. Institute of Electrical and Electronics Engineers Inc. 2019. p. 1990-1995. 8796967. (ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia).
Tamori, Tatsuru ; Akatsu, Kan. / Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor. ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 1990-1995 (ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia).
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