Investigation of Current Measurement Method of Bonding Wire by using GMR Sensor

Tatsuru Tamori, Kan Akatsu

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Recently, a miniaturization of the inverter module in the drive system is proceeding. One of the problems of the miniaturization of the inverter module is the heat generation density increase as the inverter module becomes smaller. Since a bonding wire in the inverter module is disconnected due to heat, it is necessary to early detect the disconnection for the protection of the system. In this research, by setting a GMR sensor under the bonding wire in the inverter module, we propose a small inverter module with a built-in GMR sensor. This paper focuses on a method of disconnection detection with the GMR sensor at under the bonding wire and selecting the appropriate GMR sensor position.

本文言語English
ホスト出版物のタイトルICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1990-1995
ページ数6
ISBN(電子版)9788957083130
出版ステータスPublished - 2019 5
イベント10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia - Busan, Korea, Republic of
継続期間: 2019 5 272019 5 30

出版物シリーズ

名前ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia

Conference

Conference10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia
国/地域Korea, Republic of
CityBusan
Period19/5/2719/5/30

ASJC Scopus subject areas

  • エネルギー工学および電力技術
  • 電子工学および電気工学
  • 制御と最適化

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