Isothermal shear fatigue life of Sn-xAg-0.5Cu flip chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka

研究成果: Conference contribution

抄録

The mechanical shear fatigue test has been performed to look for the effect of silver content on the fatigue properties of Sn-xAg-0.5Cu (x=1, 2, 3 and 4) flip chip interconnections. As the strength of the solder alloy increases with increasing silver content, the increase in silver content results in preventing a shear plastic deformation of solder bump. Therefore, the flip chip joints made using higher silver content solder such as 3 and 4Ag exhibit longer fatigue life, if the same levels of displacement is applied. The fatigue ductility of the solder decreases with increasing the silver content. Therefore, the fatigue endurance of the 1Ag solder itself is superior to other solders in high plastic strain regime, even though the strength of the solder is the lowest in the solders tested. Based on this study, the 3Ag solder might exhibit good fatigue performance for all condition, and the 1Ag solder is optimum for severe strain condition.

本文言語English
ホスト出版物のタイトルAdvances in Electronic Packaging 2003
ホスト出版物のサブタイトルVolume 1
ページ155-160
ページ数6
出版ステータスPublished - 2003 12 1
外部発表はい
イベント2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, United States
継続期間: 2003 7 62003 7 11

出版物シリーズ

名前Advances in Electronic Packaging
1

Conference

Conference2003 International Electronic Packaging Technical Conference and Exhibition
国/地域United States
CityHaui, HI
Period03/7/603/7/11

ASJC Scopus subject areas

  • 工学(全般)
  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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