Joining of Y-Ba-Cu-O/Ag bulk superconductors using Er-Ba-Cu-O/Ag solder

K. Iida, T. Kono, T. Kaneko, K. Katagiri, N. Sakai, M. Murakami, N. Koshizuka

研究成果: Article査読

9 被引用数 (Scopus)

抄録

Ag-added Y-Ba-Cu-O bulk superconductors were joined using Ag-added Er-Ba-Cu-O solder and different Er211 contents. Microstructural analysis revealed that the volume fraction of Er211 at the joint with a composition of Erl23:Er211 = 4:1 was the same as that for the expected volume fraction of the initial composition. That is, this composition seems to be optimum, since the mass balance was maintained during the crystal growth from the initial growth stage to the final stage. The trapped-field distribution for the joint using this composition was uniform and the only single peak indicated that strong coupling was achieved.

本文言語English
ページ(範囲)S46-S50
ジャーナルSuperconductor Science and Technology
17
2
DOI
出版ステータスPublished - 2004 2 1

ASJC Scopus subject areas

  • セラミックおよび複合材料
  • 凝縮系物理学
  • 金属および合金
  • 電子工学および電気工学
  • 材料化学

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