| 元の言語 | English |
|---|---|
| ページ（範囲） | 144-145 |
| ジャーナル | Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat. |
| 出版物ステータス | Published - 2006 9 13 |
これを引用
Kakuhara, Y., Kawahara;K.Ueno, Y. KN., N.Oda, N. O., & Ueno, K. (2006). Key mechanism for improved EM lifetime of CoWP capped Cu interconnects. Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat., 144-145.
Key mechanism for improved EM lifetime of CoWP capped Cu interconnects. / Kakuhara, Y.; Kawahara;K.Ueno, Y. Kakuhara;N.; N.Oda, N.Oda; Ueno, Kazuyoshi.
：: Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat., 13.09.2006, p. 144-145.研究成果: Article
Kakuhara, Y, Kawahara;K.Ueno, YKN, N.Oda, NO & Ueno, K 2006, 'Key mechanism for improved EM lifetime of CoWP capped Cu interconnects', Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat., pp. 144-145.
Kakuhara Y, Kawahara;K.Ueno YKN, N.Oda NO, Ueno K. Key mechanism for improved EM lifetime of CoWP capped Cu interconnects. Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat. 2006 9 13;144-145.
@article{bac45875a53344cb95af371ea27329b7,
title = "Key mechanism for improved EM lifetime of CoWP capped Cu interconnects",
author = "Y. Kakuhara and Kawahara;K.Ueno, {Y. Kakuhara;N.} and N.Oda N.Oda and Kazuyoshi Ueno",
year = "2006",
month = "9",
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language = "English",
pages = "144--145",
journal = "Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.",
}
TY - JOUR
T1 - Key mechanism for improved EM lifetime of CoWP capped Cu interconnects
AU - Kakuhara, Y.
AU - Kawahara;K.Ueno, Y. Kakuhara;N.
AU - N.Oda, N.Oda
AU - Ueno, Kazuyoshi
PY - 2006/9/13
Y1 - 2006/9/13
M3 - Article
SP - 144
EP - 145
JO - Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.
JF - Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.
ER -