Laser internal modification plus wet etching for micro-structuring crystalline and glassy materials

研究成果: Conference contribution

抄録

The development of fs laser technology has enabled the internal modification of transparent solid materials, performed by focusing femtosecond (fs) pulses. Using internal modification and subsequent wet etching, micrometer-scale removal processing with arbitrary three-dimensional design was enabled. We applied this technique to transparent nonphotosensitive crystalline and glassy materials. This is a unique processing technique almost impossible by other techniques.

本文言語English
ホスト出版物のタイトルICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings
出版社Laser Institute of America
ページ942-945
ページ数4
ISBN(印刷版)9780912035598
DOI
出版ステータスPublished - 2009 1 1
外部発表はい
イベント28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009 - Orlando, FL, United States
継続期間: 2009 11 22009 11 5

出版物シリーズ

名前ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings
102

Conference

Conference28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009
国/地域United States
CityOrlando, FL
Period09/11/209/11/5

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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