Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations

Ploybussara Gomasang, Satoru Ogiue, Shinji Yokogawa, Kazuyoshi Ueno

研究成果: Article

抄録

To establish the lifetime prediction model for Cu-based metallization against moisture, temperature humidity storage test under the various accelerated conditions is performed. The increase of Cu sheet resistance induced by Cu-oxidation is measured by a four-point probe method. X-ray photoelectron spectroscopy analysis is carried out to investigate the variation of oxidized Cu. The activation energy and the humidity acceleration factor for Cu-based metallization have been derived by the statistical analysis to predict the lifetime against moisture for the first time. The results indicate that Cu-based metallization is comparatively more sensitive to the temperature than humidity at around the practical use condition.

元の言語English
記事番号SBBC01
ジャーナルJapanese Journal of Applied Physics
58
DOI
出版物ステータスPublished - 2019 1 1

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Metallizing
moisture
humidity
Atmospheric humidity
Moisture
life (durability)
predictions
Sheet resistance
statistical analysis
Temperature
temperature
Statistical methods
X ray photoelectron spectroscopy
Activation energy
photoelectron spectroscopy
activation energy
Oxidation
oxidation
x rays

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

これを引用

Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations. / Gomasang, Ploybussara; Ogiue, Satoru; Yokogawa, Shinji; Ueno, Kazuyoshi.

:: Japanese Journal of Applied Physics, 巻 58, SBBC01, 01.01.2019.

研究成果: Article

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