Lossy transmission line effects in a thin-film multichip module

Toshio Sudo

研究成果: Conference article

抜粋

The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.

元の言語English
ページ(範囲)2304-2307
ページ数4
ジャーナルProceedings - IEEE International Symposium on Circuits and Systems
4
出版物ステータスPublished - 1991 12 1
イベント1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) - Singapore, Singapore
継続期間: 1991 6 111991 6 14

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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