Lossy transmission line effects in a thin-film multichip module

Toshio Sudo

研究成果: Conference contribution

抄録

The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.

元の言語English
ホスト出版物のタイトルProceedings - IEEE International Symposium on Circuits and Systems
出版者Publ by IEEE
ページ2304-2307
ページ数4
4
出版物ステータスPublished - 1991
イベント1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) - Singapore, Singapore
継続期間: 1991 6 111991 6 14

Other

Other1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5)
Singapore, Singapore
期間91/6/1191/6/14

Fingerprint

Multichip modules
Electric lines
Thin films
SPICE
Energy dissipation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

これを引用

Sudo, T. (1991). Lossy transmission line effects in a thin-film multichip module. : Proceedings - IEEE International Symposium on Circuits and Systems (巻 4, pp. 2304-2307). Publ by IEEE.

Lossy transmission line effects in a thin-film multichip module. / Sudo, Toshio.

Proceedings - IEEE International Symposium on Circuits and Systems. 巻 4 Publ by IEEE, 1991. p. 2304-2307.

研究成果: Conference contribution

Sudo, T 1991, Lossy transmission line effects in a thin-film multichip module. : Proceedings - IEEE International Symposium on Circuits and Systems. 巻. 4, Publ by IEEE, pp. 2304-2307, 1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5), Singapore, Singapore, 91/6/11.
Sudo T. Lossy transmission line effects in a thin-film multichip module. : Proceedings - IEEE International Symposium on Circuits and Systems. 巻 4. Publ by IEEE. 1991. p. 2304-2307
Sudo, Toshio. / Lossy transmission line effects in a thin-film multichip module. Proceedings - IEEE International Symposium on Circuits and Systems. 巻 4 Publ by IEEE, 1991. pp. 2304-2307
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