Low-cycle fatigue properties of eutectic solders at high temperatures

Yoshiharu Kariya, Tadatomo Suga

研究成果: Article

19 引用 (Scopus)

抄録

This paper details the deformation mechanism and low-cycle fatigue life of eutectic solder alloys at high temperature (around 0.8 Tm). Grain boundary sliding generally nucleates a wedge-type cavity that reduces the low-cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn-Ag-Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb-Sn and Bi-Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low-cycle fatigue endurance for theses eutectic Pb-Sn and Bi-Sn alloys.

元の言語English
ページ(範囲)413-419
ページ数7
ジャーナルFatigue and Fracture of Engineering Materials and Structures
30
発行部数5
DOI
出版物ステータスPublished - 2007 5

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Soldering alloys
Eutectics
Grain boundary sliding
Fatigue of materials
Temperature
Phase boundaries
Ductility
Durability
Metals
Microstructure

ASJC Scopus subject areas

  • Mechanical Engineering
  • Materials Science(all)

これを引用

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