Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima, Masamoto Tanaka

研究成果: Article査読

14 被引用数 (Scopus)

抄録

The straddle fatigue test has been performed to study the fatigue properties of Sn-1.2 mass%Ag-0.5 mass%Cu-0.05 mass%Ni for flip chip interconnections. The low cycle fatigue resistance of the alloy is equivalent to that of Sn-3mass%Ag-0.5mass%Cu alloy, even though the fatigue endurance of Sn-1 mass%Ag-0.5 mass%Cu alloy was poorer than that of the 3 mass%Ag alloy. The alloy has fine microstructure and Ag3Sn intermetallic compound makes a network structure together with fine (Cu.Ni)6Sn5 compound. The microstructure resulted in high cyclic strain hardening exponents, which leaded to good low cycle fatigue endurance of the alloy.

本文言語English
ページ(範囲)689-694
ページ数6
ジャーナルMaterials Transactions
45
3
DOI
出版ステータスPublished - 2004 3月
外部発表はい

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

フィンガープリント

「Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル