Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen

Yoshiharu Kariya, Tadatomo Suga, Tomokazu Niimi, Masahisa Otsuka

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Micro-bulk fatigue testing was developed to investigate the fatigue lives and damage mechanisms of Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys. The fatigue lives of micro-bulk solder obeyed Manson-Coffin's empirical law, and the fatigue ductility exponents were about 0.55 for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical wave profile, although fatigue resistance of Sn-3.0Ag-0.5Cu alloy was not so superior under asymmetrical wave condition. The fatigue crack was developed from extrusion and intrusion of slip band in Sn-3.0Ag-0.5Cu alloy, while the crack was observed at colony boundary in Sn-37Pb alloy. The difference in damage mechanism may affect the sensitivity of fatigue life to reversibility of loading profile.

本文言語English
ホスト出版物のタイトルProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
ホスト出版物のサブタイトルAdvances in Electronic Packaging 2005
ページ1827-1832
ページ数6
出版ステータスPublished - 2006 2月 23
外部発表はい
イベントASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
継続期間: 2005 7月 172005 7月 22

出版物シリーズ

名前Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
PART C

Conference

ConferenceASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
国/地域United States
CitySan Francisco, CA
Period05/7/1705/7/22

ASJC Scopus subject areas

  • 工学(全般)

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