Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen

Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga

研究成果: Article

元の言語	English
ページ（範囲）	1-6
ジャーナル	Proceedings of ASME International Electeronics Packing Technical Conference
巻	73165
出版物ステータス	Published - 2005 7 20

これを引用

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title = "Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen",

author = "Yoshiharu Kariya and Tomokazu Niimi and Tadatomo Suga",

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language = "English",

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journal = "Proceedings of ASME International Electeronics Packing Technical Conference",

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T1 - Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen

AU - Kariya, Yoshiharu

AU - Niimi, Tomokazu

AU - Suga, Tadatomo

PY - 2005/7/20

Y1 - 2005/7/20

M3 - Article

VL - 73165

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EP - 6

JO - Proceedings of ASME International Electeronics Packing Technical Conference

JF - Proceedings of ASME International Electeronics Packing Technical Conference

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