Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen

Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga

研究成果: Article

元の言語English
ページ（範囲）1-6
ジャーナルProceedings of ASME International Electeronics Packing Technical Conference
巻73165
出版物ステータスPublished - 2005 7 20

これを引用

Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen. / Kariya, Yoshiharu; Niimi, Tomokazu; Suga, Tadatomo.

：: Proceedings of ASME International Electeronics Packing Technical Conference, 巻 73165, 20.07.2005, p. 1-6.

研究成果: Article

Kariya, Y, Niimi, T & Suga, T 2005, 'Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen', Proceedings of ASME International Electeronics Packing Technical Conference, 巻. 73165, pp. 1-6.
Kariya Y, Niimi T, Suga T. Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen. Proceedings of ASME International Electeronics Packing Technical Conference. 2005 7 20;73165:1-6.
Kariya, Yoshiharu ; Niimi, Tomokazu ; Suga, Tadatomo. / Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen. ：: Proceedings of ASME International Electeronics Packing Technical Conference. 2005 ; 巻 73165. pp. 1-6.
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