Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Kazuki Watanabe, Yoshiharu Kariya, Naoyuki Yajima, Kizuku Obinata, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu

研究成果: Article査読

6 被引用数 (Scopus)

抄録

A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper thin films for the through hole (TH) in a printed wiring board. And the low-cycle fatigue lives were investigated according to the proposed method. Furthermore, thermal stress analysis of the TH with the finite element method was performed to predict thermal fatigue life of the TH based on Manson-Coffin law for electroplated copper thin films obtained from the low-cycle fatigue test. Low-cycle fatigue damage in the electroplated copper thin film was occurring in the grain boundaries and the damage mechanism was found same as that for thermal fatigue damage in TH in the printed wiring board. And the fatigue life of TH predicted from the Manson-Coffin law at the maximum temperature of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test.

本文言語English
ページ(範囲)20-27
ページ数8
ジャーナルMicroelectronics Reliability
82
DOI
出版ステータスPublished - 2018 3

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 原子分子物理学および光学
  • 凝縮系物理学
  • 安全性、リスク、信頼性、品質管理
  • 表面、皮膜および薄膜
  • 電子工学および電気工学

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