Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection

T. Homma

Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection

機能制御システム専攻

研究成果: Article › 査読

本文言語	English
ページ（範囲）	243-285
ジャーナル	Journal of Material Science and Technology, R
巻	R23
出版ステータス	Published - 1998 9月 16

引用スタイル

@article{b5dfbd18b7604ebc9b1add372a9b9729,

title = "Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection",

author = "T. Homma",

year = "1998",

month = sep,

day = "16",

language = "English",

volume = "R23",

pages = "243--285",

journal = "Journal of Material Science and Technology, R",

}