Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection

T. Homma

Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection

機能制御システム専攻

研究成果: Article

元の言語	English
ページ（範囲）	243-285
ジャーナル	Journal of Material Science and Technology, R
巻	R23
出版物ステータス	Published - 1998 9 16

これを引用

Homma, T. (1998). Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection. Journal of Material Science and Technology, R, R23, 243-285.

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title = "Low Dielectric Comstant Materials and Methods for Interlayer Dielectric Films in Ultra-large-scale Integrated Circuit Multilevel Interconnection",

author = "T. Homma",

year = "1998",

month = sep,

day = "16",

language = "English",

volume = "R23",

pages = "243--285",

journal = "Journal of Material Science and Technology, R",

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