Low-impedance power distribution network of decoupling capacitor embedded interposers for 3-D integrated LSI system

Katsuya Kikuchi, Koichi Takemura, Chihiro Ueda, Osamu Shimada, Toshio Gomyo, Yukiharu Takeuchi, Toshikazu Okubo, Kazuhiro Baba, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka

研究成果: Conference contribution

6 被引用数 (Scopus)

抄録

We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D finite element method (FEM) electromagnetic field simulator. We fabricated various types of capacitor mounted or capacitor embedded interposers test element group (TEG), such as surface-mounted and embedded chip capacitors, and thin film capacitors on silicon interposers using the same simple design to compare measurement results with calculation ones. As a result, the chip capacitor embedded organic interposer TEG and thin film capacitor embedded silicon interposer TEG could provide low PDN impedance at a wide frequency range of up to 10 GHz. In particular, the interposer TEGs of the thin film capacitor embedded interposer that shows a low impedance of approximately 0.001 ? could be evaluated and calculated accurately. By using chip capacitor embedded or thin film capacitor embedded interposers for 3-D integrated LSI system, it is expected that the PDN of the system can be achieved ultralow PDN impedance.

本文言語English
ホスト出版物のタイトル2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
ページ25-28
ページ数4
DOI
出版ステータスPublished - 2009
イベント2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 - Portland, OR, United States
継続期間: 2009 10 192009 10 21

出版物シリーズ

名前2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09

Conference

Conference2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09
国/地域United States
CityPortland, OR
Period09/10/1909/10/21

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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