Low temperature wafer direct bonding between GaInAsP etch stop layer and Gd3Ga5O12

Hideki Yokoi, Tetsuya Mizumoto

研究成果: Paper

抜粋

The direct bonding between GaInAsP and Gd3Ga5O12 (GGG) is reported. All wafers were chemically treated, and contacted at room temperature. The bonded samples were subjected to various device fabrication processes such as baking, thermal annealing, wet etching and exposure to the plasma discharge, for examining the bonding durability. The bonding was achieved with the heat treatment at temperatures between 110 and 330°C. The samples bonded by the heat treatment at 110 and 220°C remained bonded against all the processes. The bonding between a terraced laser diode and GGG was also performed. The GaInAsP etched surface was bonded with GGG by heat treatment at temperatures between 110 and 220°C.

元の言語English
ページ数1
出版物ステータスPublished - 1998 1 1
イベントProceedings of the 1998 International Symposium on Information Theory, CLEO/EUROPE'98 - Glasgow, Scotland
継続期間: 1998 9 141998 9 18

Other

OtherProceedings of the 1998 International Symposium on Information Theory, CLEO/EUROPE'98
Glasgow, Scotland
期間98/9/1498/9/18

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

フィンガープリント Low temperature wafer direct bonding between GaInAsP etch stop layer and Gd<sub>3</sub>Ga<sub>5</sub>O<sub>12</sub>' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Yokoi, H., & Mizumoto, T. (1998). Low temperature wafer direct bonding between GaInAsP etch stop layer and Gd3Ga5O12. 論文発表場所 Proceedings of the 1998 International Symposium on Information Theory, CLEO/EUROPE'98, Glasgow, Scotland, .