Measurement and modeling for MOS reverse current of switching DC/DC converter

Masahiro Terasaki, Yuta Oohashi, You Masuyama, Toshio Sudo

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

DC/DC converters are widely used to produce various power supply voltages required for various electronic components on a board. Though DC/DC converter is more efficient than the linear regulator is, however, the switching noise becomes larger with the increase of the switching frequency. In particular, ringing noises at the sharp rising edge of the switching waveform generated by the effect of the parasitic inductance becomes a serious issue. This noise spreads out to the whole circuit board, and then generates electromagnetic interference (EMI), which often causes a malfunction of the electronic systems. In this paper, the methods to accurately reproduce the switching waveforms and to reduce ringing noises and resulting EMI from DC/DC converters were investigated. For this purpose, several evaluation boards were designed, and total electrical model was constructed by taking into account the parasitic inductances of traces on a board. First, frequency-domain analysis for the switching loop of the DC/DC converters was executed to find the optimum condition to suppress ringing noise effectively. Next, time-domain simulation was executed by considering the recovering time of MOS reverse current, which is not provided from device vendors. Finally, measured switching waveforms were well correlated with the simulated ones, and the optimal condition to suppress the ringing noise.

本文言語English
ホスト出版物のタイトルIEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium
ホスト出版物のサブタイトル"Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014
出版社Institute of Electrical and Electronics Engineers Inc.
ページ87-90
ページ数4
ISBN(電子版)9781479961955
DOI
出版ステータスPublished - 2014 1 13
イベント2014 4th IEEE CPMT Symposium Japan, ICSJ 2014 - Kyoto, Japan
継続期間: 2014 11 42014 11 6

出版物シリーズ

名前IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014

Conference

Conference2014 4th IEEE CPMT Symposium Japan, ICSJ 2014
CountryJapan
CityKyoto
Period14/11/414/11/6

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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