Measurement of ground surface displacement using stereo vision and mechanical sensors on humanoid robots

T. Yoshimi, Y. Kawai, Y. Fukase, H. Araki, F. Tomita

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

This paper presents a system for measuring ground surface displacement using stereo vision and mechanical sensors on a humanoid robot. The stereo vision system generates a set of range data for each view by a correlation method as ground surfaces can be regarded as smoothed surfaces with random texture patterns. The mechanical sensors are encoders, gyro sensors and acceleration sensors that measure the angles of joints, angular velocity and acceleration of the robot. With those angles and the link geometry, the transfer matrices between different views are generated and used to register sets of range data.

元の言語English
ホスト出版物のタイトルProceedings of IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems, MFI 2003
出版者Institute of Electrical and Electronics Engineers Inc.
ページ125-130
ページ数6
ISBN(電子版)078037987X
DOI
出版物ステータスPublished - 2003 1 1
外部発表Yes
イベントIEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems, MFI 2003 - Tokyo, Japan
継続期間: 2003 7 302003 8 1

出版物シリーズ

名前IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems
2003-January

Other

OtherIEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems, MFI 2003
Japan
Tokyo
期間03/7/3003/8/1

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Software
  • Computer Science Applications

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  • これを引用

    Yoshimi, T., Kawai, Y., Fukase, Y., Araki, H., & Tomita, F. (2003). Measurement of ground surface displacement using stereo vision and mechanical sensors on humanoid robots. : Proceedings of IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems, MFI 2003 (pp. 125-130). [1232644] (IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems; 巻数 2003-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MFI-2003.2003.1232644