Mechanical characteristics of lead-free solder alloys in small volume

研究成果: Article › 査読

本文言語	English
ページ（範囲）	368-374
ページ数	7
ジャーナル	Journal of Japan Institute of Electronics Packaging
巻	11
号	5
DOI	https://doi.org/10.5104/jiep.11.368
出版ステータス	Published - 2008 8月

ASJC Scopus subject areas

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