Mechanical Fatigue Characteristics of Sn-3.5mass%Ag-X(X=Bi, Cu, Zn and In) Solder Alloys

Yoshiharu Kariya, Masahisa Otsuka

研究成果: Article

元の言語English
ページ(範囲)1229-1235
ジャーナルJournal of Electronic Materials
27
出版物ステータスPublished - 1998 7 1

これを引用

@article{5a75d7804b144fbb8473c368f71cc332,
title = "Mechanical Fatigue Characteristics of Sn-3.5mass{\%}Ag-X(X=Bi, Cu, Zn and In) Solder Alloys",
author = "Yoshiharu Kariya and Masahisa Otsuka",
year = "1998",
month = "7",
day = "1",
language = "English",
volume = "27",
pages = "1229--1235",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",

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TY - JOUR

T1 - Mechanical Fatigue Characteristics of Sn-3.5mass%Ag-X(X=Bi, Cu, Zn and In) Solder Alloys

AU - Kariya, Yoshiharu

AU - Otsuka, Masahisa

PY - 1998/7/1

Y1 - 1998/7/1

M3 - Article

VL - 27

SP - 1229

EP - 1235

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

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