Mechanical properties of lead-free solder alloys evaluated by miniature size specimen

Yoshiharu Kariya, Tsuyoshi Asai, Tadatomo Suga

研究成果: Conference article査読

8 被引用数 (Scopus)


Tensile and fatigue testing using miniature specimen was proposed to compare the mechanical behaviors of Sn-3.0%Ag-0.5%Cu alloy in small and large volumes respectively. It was found that the tensile strength data of the miniature specimen was not similar with clear inferiority to that of the large volume under all test conditions. The differences in their mechanical properties are attributed to dendrite morphology and intermetallic compounds size. Thus, the mechanical behavior and the solidification microstructure strongly depend on specimen volume, which suggests that small size be used to measure mechanical behaviors of solder alloys.

ジャーナルProceedings of SPIE - The International Society for Optical Engineering
5852 PART I
出版ステータスPublished - 2005
イベントThird International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics - Singapore, Singapore
継続期間: 2004 11月 292004 12月 1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • コンピュータ サイエンスの応用
  • 応用数学
  • 電子工学および電気工学


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